[9s404s37c]

6, including low-k dielectric, copper electroplating solution, dielectric layer pilot , organometallic precursor layer



2, assuming 660 U.S. dollars an ounce gold price 2007, 2008 and 2009-2011 for the 872 U.S. dollars to 920 U.S. dollars valuation.

3, including the chip adhesive film (tape) materials







Materials forecast by region.

following is a single comment;

triennial in 2004 to 2007, after growth in recent years begin to reduce, recycle silicon back again this year, shipments of temperature up to about 300 million U.S. dollars. But the ASP an average price of 0.35 dollars per square inch greater than the recent decline is more orderly, expected to be relatively stable prices during the period 2009-2011. Tracy said the key issue is due to oversupply of 300mm silicon wafers, in fact, result in decreased sales of scrap silicon, silicon materials, coupled with the complexity and variability is very difficult to clean. Therefore, when the last down-cycle, 5 companies out of the market. But as the recent amount of polysilicon for PV applications has risen steadily and significantly enhance the stimulation of production of polysilicon,led bulb, silicon market started to ignite and therefore recovery. Similarly, the recent semiconductor industry capacity utilization is high, relatively steady increase in the number of scrap silicon, silicon in the photovoltaic market to recover once again be favored.

Tracy from semiconductor materials that block of view, packaging materials in 2010, not so good, but whether the majority of the general type of packaging materials and also to have low double-digit growth, nearly 15 %. from the first half of the entire order has more than 2009 sales. Which is the fastest growing packaging resins and organic substrate. Bonding of gold shipments grew steadily, but with the rising gold price to sales rapidly. Line 2009 bonding shipments grew 5,9%, while in 2008 sales of key alloy wire 39,68 billion U.S. dollars, up 10% this year and in 2011 up to 12-13%.

packaging materials in 2011 forecast to drop to single-digit growth, while other others, such as wafer level packaging categories including media materials and WLP bump, they are in the low double-digit growth rates. Noted that bonding wires slow in 2011, almost rare to see 2% growth, or more than the Lead Frame leadframes (although leadframes shipments have exceeded the level before the fall cycle)

reduced to a special category to see;







photoresist, according to SEMI reported that those 23% growth in 2010. which 193nm light plastic moment 40% of the total market in 2010 4,5 billion dollars and nearly 5,0 billion U.S. dollars in 2011. Tracy that such plastic can continue to use the 22nm node.

resist chemicals such as photoresist remover 19% growth in 2010. Kind of in the 2003 to 2010 the average annual growth rate CAGR of 17%, compared to the previous Road Materials growth rate more than doubled.

recycling silicon (also known as waste silicon)


following is a single comment;


1, wafer includes only market sales, including SOI (silicon on insulator), However, excluding the recovery of silicon.

2,led furniture lights, including the investment market






4, Other, including ball and WLP package dielectric material.

Tracy pointed out that from a regional perspective, Japan remained the world's largest semiconductor production capacity installed base and include many advanced packaging plant. As Taiwan has many package plants and 300mm production line, so it strong. With many international companies to packaging factory moved to China, leading to nearly three quarters of the packaging materials market in China in the difficult environment in 2009 remain up.

in the following table for the global semiconductor materials market by region account;



5, only the estimated IC application




3, including to the rubber chemicals, developing solution, anti-reflective coating, contrast enhancer, edge drops of water to remove agents, adhesion promoting agent
SEMI: Semiconductor materials market rebounded to set innovative records 【Font: Big Middle Small】 Time: July 26, 2010

The following table is a global packaging materials market forecasts by type of dollars in years;

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SEMI at SEMICON West on according to the latest data report, due to the continued increase in IC shipments, resulting in semiconductor material consumption had returned to near 2008 levels, but the expected slowdown in growth in 2011.

2010 before the Road, the total semiconductor material (fab Materials) from the 17.85 billion U.S. dollars in 2009 (compared with 2008 decreased 26,2%) increased to 21.71 billion U.S. dollars, but not yet超过 2008 level of 24.19 billion U.S. dollars. This is an analyst Dan Tracy, SEMI July 12th at the data at the annual meeting.

in 2010, is the fastest growing silicon (32% up, reached 9.41 billion U.S. dollars),5w led downlights, followed by photoresist (23% up, reached 1.13 billion U.S. dollars), and CMP, abrasive / pad (21.7% up, reached 1.11 billion U.S. dollars). As the silicon in 2009 dropped 40%, so in 2010 to become the fastest-growing item. Originally expected up to 25% increase in volume shipments of silicon, however, that Tracy will be amended to increase the final 31-32%. (Q2 total silicon area shipments according to the chain growth of at least 5%.) Market where the demand for 200mm wafers 2007-2008 decline, the current analog and discrete devices as the demand to reverse the downward trend has started to rise. It noted that even 6-inch silicon wafer demand in May when the chain up 20%.

Tracy further pointed out that the declining cycle of silicon suppliers deal a heavy blow, and we wanted 2010 prices rebounded.

the lowest growth in 2010, only one digit is wet reagents (4.0% up, reached 941 million U.S. dollars), mask (7.1% up, reached 2.93 billion U.S. dollars) and splash target shooting (9,8% up, reached 391 million U.S. dollars). Others were in double-digit.

entered in the slower growth in 2010, only single-digit growth in the major categories are (silicon, gas, mask / photoresist / photolithography auxiliary material), while in 12 % of the growth of a CMP, sputtering target, and others.

Road table is the former semiconductor process materials used in the forecast;



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